The 2008 European Electronics Assembly Reliability Summit takes place in beautiful Tallinn, Estonia, situated on the southern coast of the Gulf of Finland.

Soldertec Global and Global SMT & Packaging are delighted to announce that a European and international conference on reliability in electronic assemblies—the European Electronics Assembly Reliability Summit—will be held at the Tallink Spa & Conference Hotel in Tallinn, Estonia, October 22nd – 24th 2008. The two-day conference will be preceded by training workshops from top trainers in their field.

It has been more than two years since the RoHS directive changed forever the way electronic products are assembled and sold in international markets. Important reliability issues with the new technologies remain unsolved. This event brings together experts in a unique opportunity to tackle this business-critical topic through industry discussion, technical collaboration, and information sharing. There are also opportunities for highlighting reliability solutions through event sponsorship as well as exhibition space for tabletop displays.

The conference will be held in the beautiful medieval Baltic city of Tallinn in Estonia. The conference hotel is situated in the city centre close to the old town, restaurants and attractions of this small but historic city. A perfect venue for networking and meeting old friends in a relaxed but absorbing atmosphere. More information on the hotel, Tallinn and transportation can be found on the Location page.

This technical conference is being held at a critical time for the electronics industry. New assembly methods and materials have introduced uncertainties about long term reliability, especially in harsh environments that need urgent and complex technical solutions. Whilst part of the industry adapts to rapidly multiplying international environmental legislation another part of our industry becomes uneasy with growing pressures to conform through changes in the supply chain, customer demands for sustainable products and the possible loss of RoHS exemptions by 2010. At the same time new reliability challenges have emerged through advances in component design and the proliferation of counterfeit components for example,” said Jeremy Pearce, technology networks manager at Soldertec Global.

“However it is not all bad news. Major consortia and experienced players are working hard to provide answers and these efforts are now starting to bear fruit. Entirely new materials and assembly technologies are being developed, including nanosolders. Are these pie-in-the-sky or real world solutions? With delegates and speakers from around the world, this event will provide great opportunities to hear the real story and network with industry experts during three days at a top class venue.

Papers from technical experts are sought on any subject relevant to reliability, including; reliability in specific industry sectors; design for reliability; production and material advancements; new inspection techniques, component issues, research consortia updates, and environmental policy development around the world. For more information, visit the call for papers page.

Table-top exhibtion opportunities are detailed on the Table-top Sponsorships page.

Europe: Andy Kellard - akellard@globalsmt.net
Americas: Lino D’Andreti - ldandreti@globalsmt.net
Asia: Amanda Tan – atan@globalsmt.net